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1. Lab Description and Capabilities
- Provides a versatile chamber for depositions of metal, metal oxide, and some ceramic films
- Deposition by physical vapor deposition or sputtering
- Conveniently co-located with XPS, Auger, Imaging Ellipsometry, X-ray Reflecitivty, X-ray Diffraction, and Nanomechanical characterization capabilities
- Dedicated to inorganic depositions to reduce contamination
- Important enabling instrumentation for various thin film studies and characterization tools
2. Deliverables
- Rapid deposition of metal, metal oxide and ceramic films of well-defined thickness, e.g. for corrosion studies
- Deposition near materials characterization suite minimizes contamination
- Metal films from physical vapor deposition or sputtering to serve as model substrates for corrosion study
- Conductive underlayers for MALDI-ToF Mass Spec samples
- Extremely uniform films to facilitate sample structure characterization on nanometer scale
- Deposition of plasmonic structures and protective coatings for Surface Enhanced Raman Spectroscopy and nanoscale scanning probe spectroscopy
3. Major Equipment and Specific Minor Equipment
- Angstrom Engineering Nexdep System with Advanced PC/PLC Automation
- Two resistive sources and one RF powered sputtering source
- 700 l/s high pace Pfeiffer turbopump with chamber of modest size provides fast pump down
- Triscroll dry roughing pump reduces contamination
- Rigidly mounted quartz crystal balance rate monitors for greater reproducibility
- Source isolation shields and easy removal chamber debris shields for easy cleaning reduce contamination
All NCERCAMP labs