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Flexible Electronics

Course description
Time: 8:30 AM - 4:30 PM
Location: 240 South Forge Street, Akron, Ohio 44325
Classroom 217 (Located inside the National Polymer Innovation Center)
Cost: $800.00 USD
CEU's: 0.8
Instructor: Louis Niederlander

Course Overview

The morning session will include an explanation of passive and active components used in the manufacture of rigid and flexible electronic devices.  We will discuss the function of each device and its purpose in a circuit.  Then we will elaborate on how the devices interact. 

The afternoon session will define the types of printed circuit materials available and their intended application (for example:  automotive, industrial, commercial, and medical).  Core materials and trace materials are different for different applications.  Of great importance is board plating materials. Solder varieties and applications will also be part of the board material session.

Instructor Biography:

niederlanderLouis Niederlander has been an electrical engineer for over 40 years.

Initially he worked in the field of Industrial Combustion, first building, then designing, and finally managing the development of Electrical and Electronic Control Systems for Industrial Boilers and Furnaces.  In essence, making fire and then using it to make glass, metals, and ceramics.

Next came the implementation of his hobby, model railroading, into his career.  Designing and patenting lighting effects, sound effects, and command control systems for model trains.  These initially started out as aftermarket devices.  Ultimately toy train manufacturers asked for application specific electronics for their companies and thus became an OEM supplier.

Finally he is a Senior R&D Engineer for an electronic medical device manufacturer in Solon, Ohio.  This involves design and development of devices that improve people’s quality of life including implantable electronics.

Intro to circuit elements

  • Passive Elements
    • Resistors
    • Capacitors
  • Active elements
    • Semiconductor types
    • Diodes
    • Transistors
    • Field effect transistors (FET)
  • Digital Circuits
    • Microelectromechanical systems (MEMS)
  • Packaging
    • Surface mount technology
    • Encapsulation and barrier

Substrate Materials

  • Solid State Electronics
    • Semiconductors
    • Limitations
      • Brittle
      • Cost
      • Supply
  • Flexible Substrates
    • Paper
    • Foils, SS (<125 um)
    • Glass (<100 um)
    • Plastic film
      • PET
      • PEN
      • PI
      • Nano and mesoscale composites
    • Textiles
    • Limitations
      • Flatness during secondary processes
  • Critical attributes / Engineered performance
    • Hygroscopicity
    • Thermal conductivity
    • Electrical properties
    • Toughness
    • Transparency
    • Flexibility (e=d/2r)
    • Barrier properties
    • CTE of elements
    • Printability
    • Compatibility with adhesives

Applications

  • Healthcare and biomedical
  • Consumer electronics
  • Transportation
  • Performance monitoring
  • Machine interaction
  • Energy management
  • Embedded electronics
  • Defense and Aerospace
  • Microfluidics

QUESTIONS?

If you have any questions or need more information about this course, please contact:

Penelope Pinkston
330-972-8303
penelo1@uakron.edu


TO REGISTER

Online Registration

OR

Registration Form

Registration information: Registration shall remain open until posted as closed on the course listing on this site.

Registrations must be guaranteed by check, a purchase order number or a credit card, otherwise the registration will not be processed. Checks should be made payable to "The Akron Polymer Technology Services Training Center" and must include a copy of your completed registration form. Course fees are due before attending.

All registrations—whether by online, phone, fax or mail—will be confirmed and considered binding and subject to all cancellation policies. If you do not receive a confirmation prior to the class, please call The Akron Polymer Technology Services Training Center to verify your registration.

Course fee includes classroom instruction, instructional materials, parking permits, continental breakfast, lunch, beverages and refreshment breaks. Travel and hotel accommodations are not included.

ENROLLMENT IS LIMITED AND ON A FIRST-COME BASIS. EARLY REGISTRATION IS STRONGLY RECOMMENDED!

Visit our registration webpage to view our cancellation/withdrawal policy.