It is with regret that we are postponing the College of Polymer Science and Polymer Engineering (CPSPE) Alumni and Industry Days event previously scheduled for April 30 - May 1, 2020.
We now have restrictions on holding large gatherings due to concerns related to COVID-19. It is very unlikely that this restriction will be lifted in time to host the Alumni & Industry Days event on April 30th.
We want to thank you for your willingness to participate and join us in this celebration, and we hope that you will be available when we reschedule the event this Fall 2020.
Celebrating UA's Sesquicentennial (1870-2020) and 111 Years of Polymer Excellence
Join us to celebrate 111 years of polymer excellence
The College of Polymer Science and Polymer Engineering at The University of Akron invites you to Alumni & Industry Days – a 2 day symposium and networking event celebrating the growth, achievements, and successes of the College and the industry through the years, and providing an exciting look at what the future holds.
Looking Ahead & Moving Forward: The Next 50 Years of Polymer Technologies
Featuring renowned researchers, distinguished alumni, and industry leaders, the symposium presentations will focus on The Next 50 Years of Polymer Technologies.
Celebrating the Outstanding Achievements of our Alumni & Students
The College will also celebrate our Student Award Winners, College Alumni Award Winner, Dr. Russell Livigni, and our Department Distinguished Alumni Award Winners, Dr. Michael Makowski (Polymer Science) and Dr. Sang Eun Shim (Polymer Engineering).
Dr. Russell Livigni,
College Alumni Award Winner
Dr. Michael Makowski,
Polymer Science Distinguished Alumni Award Winner
Dr. Sang Eun Shim,
Polymer Engineering Distinguished Alumni Award Winner
Don’t miss this opportunity to engage with the best and brightest in the polymer field
The program includes a networking session featuring company tables, student posters and a visit from Zippy. Interactive panel discussions with Distinguished Professors and Alumni including Q&A are planned. In addition to the technical content, there will be informal occasions for interactions with your alumni classmates, professors, students, speakers and industry colleagues.