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Flexible Electronics

Course Number: 113-0819 (formerly AP3477)
Date: 05/28/2021 - 05/28/2021
Time: 8:00 AM - 4:00 PM
Location: Akron Polymer Training Center, Akron, OH 44325-5404
Cost: $800.00 USD
Online Registration
CEU's: 0.8
Instructor: Louis Niederlander

Course Overview

The morning session will include an explanation of passive and active components used in the manufacture of rigid and flexible electronic devices.  We will discuss the function of each device and its purpose in a circuit.  Then we will elaborate on how the devices interact. 

The afternoon session will define the types of printed circuit materials available and their intended application (for example:  automotive, industrial, commercial, and medical).  Core materials and trace materials are different for different applications.  Of great importance is board plating materials. Solder varieties and applications will also be part of the board material session.

Instructor Biography:

niederlanderLouis Niederlander has been an electrical engineer for over 40 years.

Initially he worked in the field of Industrial Combustion, first building, then designing, and finally managing the development of Electrical and Electronic Control Systems for Industrial Boilers and Furnaces.  In essence, making fire and then using it to make glass, metals, and ceramics.

Next came the implementation of his hobby, model railroading, into his career.  Designing and patenting lighting effects, sound effects, and command control systems for model trains.  These initially started out as aftermarket devices.  Ultimately toy train manufacturers asked for application specific electronics for their companies and thus became an OEM supplier.

Finally he is a Senior R&D Engineer for an electronic medical device manufacturer in Solon, Ohio.  This involves design and development of devices that improve people’s quality of life including implantable electronics.

Intro to circuit elements

  • Passive Elements
    • Resistors
    • Capacitors
  • Active elements
    • Semiconductor types
    • Diodes
    • Transistors
    • Field effect transistors (FET)
  • Digital Circuits
    • Microelectromechanical systems (MEMS)
  • Packaging
    • Surface mount technology
    • Encapsulation and barrier

Substrate Materials

  • Solid State Electronics
    • Semiconductors
    • Limitations
      • Brittle
      • Cost
      • Supply
  • Flexible Substrates
    • Paper
    • Foils, SS (<125 um)
    • Glass (<100 um)
    • Plastic film
      • PET
      • PEN
      • PI
      • Nano and mesoscale composites
    • Textiles
    • Limitations
      • Flatness during secondary processes
  • Critical attributes / Engineered performance
    • Hygroscopicity
    • Thermal conductivity
    • Electrical properties
    • Toughness
    • Transparency
    • Flexibility (e=d/2r)
    • Barrier properties
    • CTE of elements
    • Printability
    • Compatibility with adhesives


  • Healthcare and biomedical
  • Consumer electronics
  • Transportation
  • Performance monitoring
  • Machine interaction
  • Energy management
  • Embedded electronics
  • Defense and Aerospace
  • Microfluidics